Design And Reuse Search IP IP Based SoC News Industry Articles Blogs Videos IP-SOC 2012 IP-SOC Days Login Join SDIO 3.0 Device USB 3.0 Serdes MIPI Browse Silicon IPs by Category Silicon IP Vendors Browse Verification IPs by Category Verification IPs Vendors Wanted IPs IP Analytics Industry Expert Blogs TSMC 28nm Update Q3 2012 SemiWiki Daniel Nenni Aug . 29, 2012 Reports out of Taiwan I'm in Hsinchu this week have TSMC more than doubling 28nm wafer output in Q3 2012 due to yield improvements and capacity increases while only spending 3.6B of the 8.5B forecasted CAPEX Current estimates have TSMC 28nm capacity at 100,000 300mm wafers 10 per month versus 25,000 wafers reported in the second quarter . Wow Talk about a process ramp As I mentioned before , 28nm will be the most profitable
Design And Reuse Search IP IP Based SoC News Industry Articles Blogs Videos IP-SOC 2012 IP-SOC Days Login Join SDIO 3.0 Device USB 3.0 Serdes MIPI Browse Silicon IPs by Category Silicon IP Vendors Browse Verification IPs by Category Verification IPs Vendors Wanted IPs IP Analytics Industry Expert Blogs Innovation in Design Rules Verification Keeps Scaling on Track GLOBALFOUNDRIES Foundry Files Blog Michael Noonen , Mojy Chian Aug . 29, 2012 There is an interesting dynamic that occurs in the semiconductor industry when we talk about process evolution , roadmaps and generally attempt to peer into the future . First , we routinely scare ourselves by declaring that scaling cant continue and that Moores Law is dead a declaration that has happened more often than the famously exaggerated
Microchip Technology announced their MCP47A1 Digital-to-Analog Converter. The volatile DAC is a low-power, low-cost device that features a 1.8-5.5V wide operating voltage range. The MCP47A1 DAC is available now for sampling and volume production. It is priced at $0.42 each in 5,000-unit quantities. The chip is offered in a 6-pin SC70 package. The MCP47A1 is [...]Design And Reuse Search IP IP Based SoC News Industry Articles Blogs Videos IP-SOC 2012 IP-SOC Days Login Join SDIO 3.0 Device USB 3.0 Serdes MIPI Browse Silicon IPs by Category Silicon IP Vendors Browse Verification IPs by Category Verification IPs Vendors Wanted IPs IP Analytics Industry Expert Blogs Mixed Signal Design IP Embraces Metric-Driven Verification Using RNM Mixed-Signal Design Sathishkumar Balasubramanian Aug . 27, 2012 Even though it's been over 2 months since this year's Design Automation Conference in San Francisco , I am still surprised by the response that metric-driven , mixed-signal verification gets from our design community . Cadence had quite a few customer presentations at the EDA360 Theater at DAC this year . However , there was one presentation titled Metric
The Moxa UC-8481 embedded computer is designed for multiple-WAN wireless routing. It features the Intel XScale IXP435 533 MHz RISC CPU, 32 MB NOR Flash ROM, 512 MB SDRAM, 512 MB NAND Flash, two RS-232/422/485 serial ports, two Ethernet ports, four digital input channels, four digital output channels, a CompactFlash socket, and two USB 2.0 [...]There was a time when large companies acquired smaller ones in order to fill the need for a specific product or enter a new promising market. But this is no longer the case in the EDA industry. I do not believe that Synopsys acquired either Ciranova or Springsoft because they were looking for specific technology or products. Pure market reasons are at the base of the acquisitions.View the full article HERE
Texas Instruments rolled out the ULN2003LV relay driver. The ULN2003LV is a low-voltage and low power upgrade of TI’s ULN2003 family of 7-channel Darlington transistor array. It is the first fully-integrated, seven-channel relay driver that can support low-voltage relays from as low as 1.8 V up to 5 V. The device is available in 10mm [...]
: Design And Reuse Search IP IP Based SoC News Industry Articles Blogs Videos IP-SOC 2012 IP-SOC Days Login Join SDIO 3.0 Device USB 3.0 Serdes MIPI Browse Silicon IPs by Category Silicon IP Vendors Browse Verification IPs by Category Verification IPs Vendors Wanted IPs IP Analytics Industry Expert Blogs Q Cadence VP Martin Lund Brings User Perspective to Semiconductor IP Industry Insights Blog Richard Goering Cadence Aug . 20, 2012 Martin Lund joined Cadence in early 2012 as senior vice president of R D for the SoC Realization Group . He hasn't worked for an EDA company in the past , but 12 years at Broadcom most recently as senior vice president and general manager of Broadcom's Network Switching Business gave him a hands-on perspective on the challenges of system-on-chip SoC design and
Bruker introduced the Photoconductive Module for the Dimension Icon Atomic Force Microscope (AFM). The Photoconductive Atomic Force Microscopy (pcAFM) enables sample illumination while performing nanoscale electrical characterization. Bruker’s pcAFM accessory transforms the Dimension Icon AFM into a solution for dedicated nanoscale organic photoelectric material research. Read more: Bruker Announces Photoconductive Atomic Force Microscopy Module Twitter [...]
Texas Instruments debuted the DS90UB913Q serializer and DS90UB914Q deserializer. The TI components provides a seamless video and data interface to megapixel driver assist camera modules, with no software overhead and fewer wires. This results in reduced power consumption, cost and weight. The DS90UB913Q and DS90UB914Q are available now for $5.36 each (in 1,000-unit quantities). The [...]
Lantronix launched their xSenso analog device server (ADS). xSenso enables sensors with analog outputs to send real-time data to any node on the network or over the Internet. The device remotely monitors and logs data from a variety of sensors — including temperature, humidity, pressure, level, flow, weight, and gas/air quality transmitters. xSenso can be [...]
Greenvity Communications launched their Hybrii system-on-chip family. The hybrid SoC integrates powerline communication (PLC) and wireless capabilities on a single chip. Hybrii devices currently include the Hybrii-XL chip for smart grid, smart energy management, industrial and consumer applications, and the Hybrii-PLC device for rugged, high temperature conditions. Samples and evaluation kits of the Hybrii-XL (GV7011) [...]